Local procust Aluminum foundation plate

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Material Classification： · Import Aluminum foundation plate · Local procust Aluminum foundation plate

MK-CH-01

Release Time：2009-11-06 11:49:54 Source：　Views：

Metal Core Board Specification

ltem	Test Condition	MK-TW-01		MK-CH-01
ltem	Test Condition	Estimated	Test result	Estimated	Test result
Thermal resistance Max(℃/W)	A	≤2.0	0.7	≤2.0	0.8
Thermal Conductivity	Not available	Not available	Not available	Not available	Not available
Dielectric Breakdown (Kv)min	A	≥2.2	8.3	≥2.0	5.5
Dielectric constant at 1 MHz Max	(40°c,90%,96h)①	≤4.4	2.4	≤4.4	4.2
Peel Strength min(N/mm)	A	1.8	1.9	1.8	2.0
Peel Strength min(N/mm)	After thermal stess	1.8	1.8	1.8	1.8
Flammability	A	Fv-o	Fv-o	Fv-o	Fv-o
Blister test After thermal stress	A	288°C 2 min No delamination	OK	260℃2min No delamination	OK
Blister test After thermal stress	After thermal impact	288°C 2 min No delamination	OK	260℃2min No delamination	OK
Volume resistivity min(MΩ.m)	A	≥1×10⁶	1××10⁷	≥1×10⁶	4×10⁷
Volume resistivity min(MΩ.m)	(90%,35°C,96h)①	≥1×10⁶	1.9××10⁷	≥1×10⁶	5×10⁷
surface resistivity min(MΩ)	A	≥1×10⁵	4.5×100⁶	≥1×10⁵	5×10⁶
surface resistivity min(MΩ)	(90%,35°C,96h)①	≥1×10⁵	4.5×100⁶	≥1×10⁵	2×100⁶
Dielectric dissipation factor(Kv)	(40°c,90%,96h)①	≥2.2	8.3	≥2.0	5.5
Aluminum Base		97%	97%	97%	97%

This test was done on MCB which the has Aluminum with 1mm thk & the dielectric layer with 0.07mm thk & the copper with 0.035mm thk(1oz).
* 1)2,3 or …. Oz copper it is available.
* 2) If the more thicker dielectric layer is needed it is available.
* 3) If the more thicker Aluminum base is needed it is available.
① : (Constant,humidity,treatment)

Difference of thermal resistance by structure

Structure:
    ■ Copper Foil
    ■ Insulation
    ■ Alminium Base

Description and Application:
Aluminum base conppet-clad laminate have excellent flame retardant , high mechanical strength, dimensional stability etc. Especially has veery good heat sink, electromagnetic shielding ang solder float. It’s widely used for the modifier and sparker on fire for motorcycle ang mobile, power LED, s0und box, power supply module and acoustics shielding system etc.

Boaard size	Structure	Material
330mm×380mm (13"×15") 500mm×600mm (20"×24") 500mm×500mm (20"×20") 333mm×500mm (13"×20")	Copper Foil	18um、35um、70um、105um、140um、210um
	Insulation (Thermal Conductivity)	80~200um
	Metal Base (Aluminum/Copper/ Iron)	0.5mm、0.8mm、1.0mm、1.2mm、1.5mm、 2.0mm、2.5mm、3.0mm、4.0mm

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