|
Item |
Mass Production Capacity |
Pilot Run Production Capacity |
|
Layer Counts
|
2--16
|
28
|
|
Material
|
High TG,Thick Film Substrate
|
PPO/PPE,
|
| Aluminum Base,Rogers,etc
FR-4,FPC,TEFLON, |
Nelco, ect
|
|
Material Mixed Laminate
|
4 layers -- 8 layers
|
10 layers --14 layers
|
|
Maximum Size
|
610mm X 1100mm
|
|
Board Outline Tolerance
|
±0.13mm
|
±0.10mm |
Board Thickness
|
0.40mm--6.00mm
|
0.35mm--8.00mm |
Thickness Tolerance( t≥0.8mm)
|
±8%
|
±5% |
Thickness Tolerance( t＜0.8mm)
|
±10%
|
±8% |
Insulation Layer Thickness
|
0.10mm--6.00mm
|
0.075mm--0.100mm |
Minimum Line
|
0.10mm
|
0.075mm |
Minimum Space
|
0.10mm
|
0.075mm |
Out Layer Copper Thickness
|
35um--175um
|
35um--210um |
Inner Layer Copper Thickness
|
17um--175um
|
17um--210um |
Drilling Hole (Mechanical)
|
0.25mm--6.35mm
|
0.15mm--0.25mm |
Finish Hole (Mechanical)
|
0.20mm--6.30mm
|
0.10mm--0.20mm |
Diameter Tolerance (Mechanical)
|
0.05mm
|
|
Registration (Mechanical)
|
0.075mm
|
0.050mm |
Laser Hole
|
0.10mm
|
0.075mm |
Aspect Ratio
|
10:1
|
12:1;16:1 |
Solder Mask Type
|
LPI
|
|
SMT Mini. Solder Mask Width
|
0.10mm
|
0.075mm |
Mini. Solder Mask Clearance
|
0.05mm
|
0.025mm |
Plug Hole Diameter
|
0.25mm--0.60mm
|
0.70mm--1.00mm |
Impedance Control Tolerance
|
±10%
|
±5% |
Surface Finish
|
HASL, Immersion Gold, |
Immersion Tin |
|
Plating Gold, etc,OSP |
|
|
Comment: Pilot Run Production means only medium order or small order for that kind production
|
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