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           Product type
  Metal Core PCB
  FR-4
  High Frequency
  Ceramic Baes
  FPC
           Materials performance
Metal foundation plate
ROGERS
Category of TEFLON
FR-4 Fiber board
 
FR-4 Woven E-glass Fabric Epoxy,Flame Resistant Copper Clad Laminate
  Character Application
Natural color It's normal epoxy resin、glass cloth copper clad laminates. It's widely used in computer, electric exchange machine, mobile phone, periphery products of computer, office automatic equipment, automatic equipment, instrument & electric products for aviation, and some senior household electric machine, Excellent quality stability. It can fulfill the requirement of SMT and sealed package substrate.
Black color It's modify-epoxy, glass cloth board. It has UV-Block & visible light-Block function, and suitable for making PCB board that used for the exposure of double board. Also it’s a kind of good solvent-resistance material, when placed in the ultrasonic-cleaning, it will never discolored, never pollute the PCB. It's widely used in the optics equipment & instrument, camera, digital display, lattice display, LED display, the basic board making for the huge screen display implement, and some other special electric parts & electric insulated structure parts. The product equips high stability for quality & high unknitibility.
Technical superiority: our company making the 0.1 mm basic board with top-ranking technical level, which can totally block the visible light. And our company is famous for the technology.
White color
It's modify-epoxy, glass cloth board. It has UV-Block & visible light-Block function, and suitable for making PCB board that used for the exposure of double board. Best white color, good glistening for the visible light. it's widely used in digital display, lattice display, LED display, huge screen display implement, electric guide, the basic board for the electric scutcheon and some other special electric parts & electric insulated structure parts.
 
Description
Value
< 0.50mm
Value
≥0.50mm
Unit
Peel Strength, min.
0.5 OZ Copper
0.5 OZ Copper
After Solder
At 125℃
After process solution
0.70

0.80
0.70
0.55
0.7

1.05
0.7
0.8
N/mm
Volume Resistivity, min.
A C-96/35/90
After moisture resistance
After elevated temp. E-24/25
106
--
103
--
106
103

MΩ-CM

Surface resistivity, min.
A C-96/35/90
After moisture resistance
After elevated temp. E-24/25
104
--
103
--
104
103
MΩ
Water Absorption, max.
--
0.80
%
Dielectric breakdown, min.
--
40
KV
Permittivity @ 1MHz, max.
(Laminate or prepreg as laminate)
5.4
5.4
--
Loss tangent @ 1MHz, max.
(Laminate or prepreg as laminate)
0.035
0.035
--
Flex Strength, min.
Length direction
Cross direction
--
--
415
345
N/mm2
Glass Transition temp. (Tg).
125
125
Arc resistance, min.
60
60
S
Thermal stress 10 Sec.@ 288℃, min.
Unetched
Etched
Pass Visual
Pass Visual
Pass Visual
Pass Visual
S
Electric strength, min.
(Laminate or prepreg as laminate)
30
--
Kv/mm
Flame ability
Average burn time, max.
Individual burn time, max.
V-0
V-0
S
Test method:IPC-TM-650
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