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1、 Microwave Circuit Feature by the use of the Substrates: |
| (1)Dieletric Constant:Ranging from 3 to 16 with long-term stability and operating temperature from-100℃+0+150℃ at designers' choice. |
| (2)The adhesive strength between copper foil and dielectric material is higher than that of vacuum coating on ceramic substrate,being easy of circuit fabrication with high output rate of end products and much lower cost than those of ceramic ones. |
| (3)Dielectric Constant Tangent(tgδ):≤10ˉ3(Dielectric loss decreases with the increase of fabrication processes between the substrates decreases with the increase of frequency). |
| (4)Easy machine-shaping by drilling-machine,lathe,milling-machine,shearer and photo-fabrication.Thus,there is no comparison processes between the substrates described above and ceramic ones. |
| 2、 Technical specification: |
| (1) Outward appearance: Two-sided smooth, does not have the spot, the scar, is hollow and so on. |
| (2) Dimensions and Tolerance: |
| a) Dimensions:A×B(mm)：50×30，80×40，120×80； A(B)Tolerance ≤±0.03 120×100，150×150，220×160；A(B)Tolerance≤±0.05 |
| b) Thickness and Tolerance:δ(mm)0.8±0.03；1±0.04；1.2±0.05 1.5±0.06；2±0.08 |
| (3) Mechanical Properties: |
| a. Copper Peel Strength:≥6N/cm(in normal condition). ≥4N/cm(in alternatively damp and hot condition). |
| b. Chemical Properties:Printed-circuits made by photo-fabrication with the performances of the dielectric materials of the substrate unchanged. |
| (4) Physics electrical specification. Bears the solder dip: 30W; Constant temperature iron 200 ℃ 20 seconds. Physics electrical specification sees the table: |
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