| This product is made from import woven-glass of fine fiber with high purity and high homogeneous degree of thickness and impost super thin copper foils, completed through the teehnological processes as same as that for woven-glass TPEF laminate substrates.This makes it ideal for microwave and millimeter wave circuit applications with the circuits made of super fine line width and gaps. |
| ※Technical Specifications: |
| 1、Mehanical Properties and Electrical Specifications: |
| a. Flexibility Factory: |
|
Thickness(mm) |
Maxi am Flexibility Factor(mm/mm) |
|
Laminate Board
With smooth Surfaace |
Single-sided
Copper-clad |
Double-sided
Copper-clad |
|
0.25-0.5 |
0.03 |
0.05 |
0.025 |
|
0.8-1.0 |
0.025 |
0.03 |
0.020 |
|
1.5-2.0 |
0.020 |
0.025 |
0.015 |
|
3.0-5.0 |
0.015 |
0.020 |
0.010 |
|
| b. Shearing and punching Properties: |
| Shearing: ＜1mm thickness without burrs after shearing, the minimum separation between two holes punched being 0.55without peeling off. |
| ≥1mm thickness without burrs after，the minimum separation between two holes punched being 1.10 without peeling off. |
c.Copper Peel Strength: ≥15N/cm(in normal condition).
≥12N/cm（being Kept in constant damp and hot and 260℃±2℃ solder conditions for 20seconds without blisters and peeling off） |
| d.Chemical Properties:Printed-circuits made by photo-fabrication with the performance of the dielectric materials of the substrate unchanged and moralizing holes process ability. |
| e.Physical and Electrical Properties:See"Table of Performance"Characteristics of Main Substrates affianced. |
|
Number |
Item |
Test Condition |
Unit |
Target value |
|
1 |
Gravity |
In normal |
g/㎝² |
2.2～2.3 |
|
2 |
Water Absorption |
Soaking in Distilled water of20±2℃ for 24 hours. |
% |
≤0.02 |
|
3 |
Operating Temperature |
High AND Low Temperature Oven |
℃ |
-50～+260 |
|
4 |
Heat Conduction Coefficient |
|
千卡/米小时℃ |
0.8 |
|
5 |
Linear Expansion Coefficient |
Arise of 96℃ in Temperature/hour |
热膨胀数×1 |
≤5×10-5 |
|
6 |
Shrinkage |
To be boiled in Boiling water for 2 hors. |
% |
0.0002 |
|
7 |
Surface Insulation Resistance |
500V direct current |
normal |
M.Ω |
≥1×10-4 |
|
const damp and hot |
≥1×10-3 |
|
8 |
Bulk Resistance |
In normal conditio |
MΩ.cm |
≥1×10-6 |
|
const damp and hot |
≥1×10-5 |
|
9 |
Resistance Between Plugs |
500V direct current |
In normal conditio |
MΩ |
≥1×10-5 |
|
In constant damp condition |
≥1×10-3 |
|
10 |
Surface Electric Strength |
In normal conditio |
δ=1mm(kv/mm) |
≥1.2 |
|
In constant damp condition |
≥1.1 |
|
11 |
Dielectric Constant |
10GHz |
εr |
|
|
12 |
Dielectric Constant Tangent |
10GHz |
tgδ |
≤1×10-3 |
|
| 2、Special Properties: |
| a. High accuracy of fine line width of printed-Circes made from the substrate because of the adoption of mport super thin copper foils. |
| b. Higher homogeneous degree of copper foil thickness makes the circuit performances ideal for a good design effect. |
| c. The copper peel strength has been increased further. |
| 3、Rhickness of Copper-clad Substrates:It varies from 0.07mm to 0.25mm according to the circuit design desired by customers. |
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