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           Product type
  Metal Core PCB
  FR-4
  High Frequency
  Ceramic Baes
  FPC
           Materials performance
Metal foundation plate
ROGERS
Category of TEFLON
FR-4 Fiber board
 
F4T-1/2 PTFE Copper-clad Substrate
　　This products is made up of oxygenated copper foils clad on both sides of a straight PTFE sheet by way of high-temperate,high-pressure,baking and sintering processes.This substrate is also called“Straight PTFE Substrate”for short,and makes it ideal for favorable microwave printed-circuit one with the finest eletrical performances in microwave dielectrc materials(that is low dielectric constant and low loss)and a certain mechanical strength as well.
※Technical Specifications:
1、Exterior Looks:In conformity to the exterior looks,performances of microwave printed-circuit substrate materials specified by both the National and Milirary Standards.
2、Dimensions(mm):200×300，220×160，150×150
3、Thickness and Tolerance:0.5±0.05,1±0.1,1.5±0.15,2±0.2,3±0.3
4、Mechanical and Properties:
　 a. Flexibility Factor:0.02mm/mm for double-sided substrate.
　 b. Shearing and Punching Properties:Without burrs after shearing and the minimum separation between two holes punched being 0.05.
　 c. Copper Peel Strength:≥8N/cm(in normal condition) ≥6N/cm(being kept in constant damp and hot and heat-soldering condition for 20seeonds).
5、Chemical Properties:
　 Printed-circuits made by photo-fabrication with the mechanical and electrical proportions of the dielectric materials of the substrste unchanged.
6、Physical and Elestrical Properties:
Number
Item
Test Condition
Unit
Target value
1
Gravity
In normal
g/㎝²
2.2～2.3
2
Water Absorption
Soaking in Distilled water of20±2℃ for 24 hours.
%
≤0.01
3
Operating Temperature
High AND Low Temperature Oven
℃
-100～+150
4
Heat Conduction Coefficient
Kcal/m.hour℃
0.4
5
Linear Expansion Coefficient
Arise of 96℃ in Temperature/hour
×1
9.8～10×10-5
6
Shrinkage
To be boiled in Boiling water for 2 hors.
%
0.0005
7
Surface Insulation Resistance
500V direct current
normal
M.Ω
≥1×10-7
const damp and hot
≥1×10-5
8
Bulk Resistance
In normal conditio
MΩ.cm
≥1×10-10
const damp and hot
≥1×10-7
9
Resistance Between Plugs
500V direct current
In normal conditio
MΩ
≥1×10-5
In constant damp condition
≥1×10-5
10
Surface Electric Strength
In normal conditio
δ=1mm(kv/mm)
≥1.5
In constant damp condition
≥1.4
11
Dielectric Constant
10GHz
εr
2.2(±2%)
12
Dielectric Constant Tangent
10GHz
tgδ
≤1×10-3
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