| This product is made from E-grade woven-glass,half solidification piece and TPFE resin with scientific compound by way of strict press processes.It is dielectric constant goes on over a wide range. |
| ※Technical Specifications: |
| 1、Exterior Looks: In conformity to the exterior looks,performances of microwave printed-circuit substrate materials specified by both the National and Milirary Standards. |
| 2、Types: F4BM220；F4BM255；F4BM265；F4BM300；F4BM350。其中220、255、265、300、350分别代表其介电常数为2.20、255、2.65、3.0、3.50。 |
| 3、Dimensions(mm): 300×250、350×380、500×500、600×500、840×840、840×1200 |
| 4、Thickness and Tolerance: |
| Thickness(mm): 0.25，0.5，0.8，1.0
Tolerance(mm):±0.02～±0.04 |
| Thickness(mm): 1.5，2.0，3.0，4.0，5.0
Tolerance(mm):±0.05～±0.07 |
| 5、Mechanical Properties: |
| a. Flexibility Factory: |
|
Thickness(mm) |
Maxi am Flexibility Factor(mm/mm) |
|
Laminate Board
With smooth Surfaace |
Single-sided
Copper-clad |
Double-sided
Copper-clad |
|
0.25-0.5 |
0.03 |
0.05 |
0.025 |
|
0.8-1.0 |
0.025 |
0.03 |
0.020 |
|
1.5-2.0 |
0.020 |
0.025 |
0.015 |
|
3.0-5.0 |
0.015 |
0.020 |
0.010 | |
| b. Shearing and punching Properties: |
| Shearing: ＜1mm thickness without burrs after shearing, the minimum separation between two holes punched being 0.55without peeling off. |
| ≥1mm thickness without burrs after，the minimum separation between two holes punched being 1.10 without peeling off. |
c.Copper Peel Strength: ≥15N/cm(in normal condition).
≥12N/cm(being Kept in constant damp and hot and 260℃±2℃ solder conditions for 20seconds without blisters and peeling off) |
| d.Chemical Properties: |
| Printed-circuits made by photo-fabrication with the performance of the dielectric materials of the substrate unchanged and moralizing holes process ability. |
| e.Physical and Electrical Properties: |
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