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Metal foundation plate
ROGERS
Category of TEFLON
FR-4 Fiber board
 
CTP-1/2 High Polymer Magnetic Composite-dielectric Subtract
　　The high polymer magnetic microwave composite-dielectric substrate is made up of the composition of low loss minerals,high polymer magnetic materials and organic plaits in proper proportion.Then a copper-clad substrate is achieved by way of baking,sintering and press process,on which super thin copper foils being pressed finally.It is used widely for mobile communications,micro strip antennas,circulators,isolators as well as others microwave devices.This type of substrate is the first of it's kind in China and in the lead worldwide.
　　1.Micros trip Circuit Features by use of the Substrate:
　　(1) The adhesive strength between copper foil and dielectric is higher than that of the vacuum coating on ferrite substrate,being easy of circuit fabrication with high output rate of end products and much lower cost than that of ferrite one.
　　(2) Easy machine-shaping by drilling-machine,lathe,milling-machine,shearer and photo fabrication.There is no comparison of fabrication processes between the substrate descirbed above and ceramic one.
　　2.Technical Specifications:
　　(1) Exterior Looks:Well plane ness on both sides of the substrate sceatches,hollows,copper without foil stains folded and pinholes.
　　(2) Dimensions(mm):120×100，135×135，150×150，
　　(3) Dimensions and Tolerance(mm):0.8±0.03 1±0.04 2±0.06
　　(4) Mechanical Properties:
　　　　a. Copper Peel Strength:≥10N/cm (in normal condition).
8N/cm (in alter mating damp and hot condition).
　　　　b.Tensile Strength:≥800Kg/cm2
　　(5) Chemical Properties:Printed-circuits made by photo-fabrication with the performances of the dielectric materials of the substrate unchanged.
　　(6) Physical and Electrical Properties:
Number
Item
Test Condition
Unit
Target value
1
Gravity
In normal
g/㎝²
2
2
Water Absorption
Soaking in Distilled water of20±2℃ for 24 hours.
%
≤0.01
3
Operating Temperature
High AND Low Temperature Oven
℃
-100～+150
4
Heat Conduction Coefficient
Kcal/m.hour℃
0.7
5
Linear Expansion Coefficient
Arise of 96℃ in Temperature/hour
×1
≤1×10-4
6
Shrinkage
To be boiled in Boiling water for 2 hors.
%
0.0002
7
Surface Insulation Resistance
500V direct current
normal
M.Ω
≥1×10-9
const damp and hot
≥1×10-8
8
Bulk Resistance
In normal conditio
MΩ.cm
≥1×10-9
const damp and hot
≥1×10-9
9
Resistance Between Plugs
500V direct current
In normal conditio
MΩ
≥1×10-8
In constant damp condition
≥1×10-9
10
Surface Electric Strength
In normal conditio
δ=1mm(kv/mm)
≥1.5
In constant damp condition
≥1.4
11
Dielectric Constant
10GHz
εr
6～8(±2%)
12
Dielectric Constant Tangent
10GHz
tgδ
≤1×10-3
13
Magnetism Parameter
3GHz
μ′=1.4～3
μ"=1×10-3
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