|
This substrate of good quality is widely and specially used to microware printed-circuits.It is made from import highly rated materials and completed through high-temperature,high-pressure,baking and sintering processes according To the electrical requirements of a microwave circuit. |
| ※Technical Specifications: |
| 1、Exterior Looks: In conformity to the exterior looks,performances of microwave printed-circuit substrate materials specified by both the National and Milirary Standards. |
| 2、Normal Dimensions(mm): 840×840；600×500；500×500；500×430；380×350；300×250 |
| 3、Thickness of Copper-clad(mm): 0.035mm或0.018mm |
| 4、Thickness and Tolerance: |
| a. The normal thickness of copper-clad includes that of the copper sheets on both sides of the substrates. |
| b. Thickness and Tolerance |
|
Thickness(mm) |
0.17,0.25 |
0.5,0.8,1.0 |
1.5,2.0 |
3.0,4.0,5.0 |
|
Tolerance(mm) |
±0.01 |
±0.03 |
±0.05 |
±0.06 |
|
| c. Specified dimensions can be assigned according to the requirements of customers' circuit design. |
| 5、Metamucil Properties: |
| a. Flexibility Factory: |
|
Thickness(mm) |
Maxi am Flexibility Factor(mm/mm) |
|
Laminate Board
With smooth Surfaace |
Single-sided
Copper-clad |
Double-sided
Copper-clad |
|
0.25-0.5 |
0.03 |
0.05 |
0.025 |
|
0.8-1.0 |
0.025 |
0.03 |
0.020 |
|
1.5-2.0 |
0.020 |
0.025 |
0.015 |
|
3.0-5.0 |
0.015 |
0.020 |
0.010 |
|
| b. Shearing and punching Properties: |
| Shearing: ＜1mm thickness without burrs after shearing, the minimum separation between two holes punched being 0.55without peeling off. |
| ≥1mm thickness without burrs after，the minimum separation between two holes punched being 1.10 without peeling off. |
| c.Copper Peel Strength: ≥15N/cm(in normal condition). |
| ≥12N/cm(being Kept in constant damp and hot and 260℃±2℃ solder conditions for 20seconds without blisters and peeling off) |
| d.Chemical Properties:Printed-circuits made by photo-fabrication with the performance of the dielectric materials of the substrate unchanged and moralizing holes process ability. |
| e.Physical and Electrical Properties:See"Table of Performance"Characteristics of Main Substrates affianced. |
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