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           Product type
  Metal Core PCB
  FR-4
  High Frequency
  Ceramic Baes
  FPC
           Materials performance
Metal foundation plate
ROGERS
Category of TEFLON
FR-4 Fiber board
■ Category of TEFLON
  Microwave dielectric printed-circuit substrates with perfect electrical performance characteristics and better mechanical strength are made from straight TEFLON sheets and woven-glass TEFLON laminate sheets with single-sided and double-sided copper-clad substrates or copper-clad and cloudlet-sided copper-clad substrates or copper-clad on one side of the substrate and aluminum-clad(copper) on the other side of it by way of high-temperatuer,baking and sintering processes.
F4B-1/2(M:1-GT)Woven-glass TEFLON Copper-clad Substrate
F4BM-1/2 Woven-glass TEFLON Copper-clad Substrate with a Wide Range of Dielectric Constant
F4BK Woven-glass TEFLON Copper-clad Substrate with a Wide Range of Dielectric Constant
F4B-1/A1(Cu) Woven-glass TEFLON Aluminum-clad (copper)Substrate
F4T-1/2 TEFLON Copper-clad Substrate
(M:1-GX)High-temperature Super thin Copper-clad Substrate
Woven-glass TEFLON
■ Category of Composite-dielectric Constant
  The microwave composite-dielectric copper-clad substrate is made up of the composition of the low loss mineral titanic(TiO2) and low loss organic plastic in proportion achieved by way of baking,sintering and press processes,on which then super thin copper foils being clad by pressing process.This makes the substrates the best ones for microwave components,devvices and printed-circuit device in satellite communications,navigation,solid-state phase-array radars,broadcasting and Television fields.
TP-1/2 Microwave Composite-dielectric Substrate
TF-1/2 PTFE-Ceramic Composite-dielectric Substrate
CTP-1/2 High Polymer Magnetic Composite-dielectric Subtract
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