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RO4000® Series High Frequency Circuit Materials |
Features:
·Non-PTFE - Thermoset Resin System
·Excellent high frequency performance due to low dielectric tolerance and loss
·Stable electrical properties versus frequency
·Low thermal coefficient of dielectric constant
·Low Z-Axis expansion
·Low in-plane expansion coefficient
·Excellent dimensional stability
·Volume manufacturing process
Some Typical Applications:
·LNBs for Direct Broadcast Satellites
·Cellular Base Station Antennas and Power Amplifiers
·Spread Spectrum Communications Systems
·RF Identifications Tags
·Automated Test Equipment
·High Speed Backplanes and Line Cards
·High Frequency Automotive Electronics |
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| RO4000® Series High Frequency Circuit Materials are glass reinforced hydrocarbon/ceramic thermoset laminates (Not PTFE) designed for performance sensitive, high volume commercial applications. |
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| RO4000 laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR4) processes offered at competitive prices. |
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| The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. RO4000 material possesses the properties needed by designers of RF/microwave circuits. Stable electrical properties over broad environmental conditions allow for repeatable design of filters, matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4000 series materials to be used in many applications where higher operating frequencies limit the use of conventional circuit board laminates. The temperature coefficient of dielectric constant is among the lowest of any circuit board material (Chart 1), making it ideal for temperature-sensitive applications. RO4000 materials exhibit a stable dielectric constant over a broad frequency range (Chart 2). This makes it an ideal substrate for broadband applications. |
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| RO4000 material's thermal coefficient of expansion (CTE) provides several key benefits to the circuit designer. The expansion coefficient of RO4000 material is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multilayer board constructions. The low Z-axis CTE of RO4000 laminates provides unmatched plated through-hole quality, even in severe thermal shock applications. RO4000 series material has a Tg of >280℃ (536°F) soits expansion characteristics remain stable over the entire range of circuit processing temperatures. |
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| RO4000 series laminates can easily be fabricated into printed circuit boards using standard FR4 circuit board processing techniques. Unlike PTFE-based high performance materials, RO4000 series laminates do not require specialized via preparation processes such as sodium etch. This material is a rigid, |
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| thermoset laminate that is capable of being processed by automated handling systems and scrubbing equipment used for copper surface preparation. |
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| RO4003 laminates are currently offered in various configurations utilizing both 1080 and 1674 glass fabric styles, with all configurations meeting the same laminate electrical performance specification. Responding to the need for higher Relative Thermal Index (RTI) values than 105℃, we have developed the RO4350Bwhich exhibits RTI values as high as 150℃. Specifically designed as a drop-in replacement for RO4350 material, RO4350B laminate is the standard flame retardent product in the RO4000 product line. These materials conform to the requirements of IPC-4103, slash sheet /10 for RO4003C and /11 for RO4350B. |
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Chart 1: RO4000 Series Materials
Dielectric Constant vs. Temperature |
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Chart 2: RO4000 Series Materials
Dielectric Constant vs. Frequency |
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Chart 3: Microstrip Insertion Loss
(0.030" Dielectric Thickness) |
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| PROPERTY |
TYPICAL VALUE |
DIRECTION |
UNITS |
CONDITION |
TEST METHOD |
| RO4003C™ |
RO4350B™(1) |
Dielectric
Constant, ,
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3.38±0.05 |
3.48±0.05(2) |
Z |
-- |
10 GHz/23℃
2.5 GHz/23℃ |
IPC-TM-650
2.5.5.5 |
Dissipation
Factor, tan  |
0.0027
0.0021 |
0.0037
0.0031 |
Z |
|
10 GHz/23℃
2.5 GHz/23℃ |
IPC-TM-650
2.5.5.5 |
Thermal
Coefficient of , |
+40 |
+50 |
Z |
ppm/℃ |
-100℃ to 250℃ |
IPC-TM-650
2.5.5.5 |
| Volume Resistivity |
1.7x1010 |
1.2 X 1010 |
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MΩ·cm |
COND A |
IPC-TM-650
2.5.17.1 |
| Surface Resistivity |
4.2x109 |
5.7 X 109 |
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MΩ |
COND A |
IPC-TM-650
2.5.17.1 |
| Electrical Strength |
31.2
(780) |
31.2
(780) |
Z |
MΩ |
0.51mm
(0.020") |
IPC-TM-650
2.5.6.2 |
| Tensile Modulus |
26,889
(3900) |
11,473
(1664) |
Y |
MPa
(kpsi) |
RT |
ASTM D638 |
| Tensile Strength |
141
(20.4) |
175
(25.4) |
Y |
MPa
(kpsi) |
RT |
ASTM D638 |
| Flexural Strength |
276
(40) |
255
(37) |
--- |
MPa
(kpsi) |
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IPC-TM-650
2.4.4 |
| Dimensional Stability |
<0.3 |
<0.5 |
X,Y |
(mils/inch) |
after etch
+E2/150°
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IPC-TM-650
2.1.41 |
Coefficient
of Thermal
Expansion |
11
14
46 |
14
16
50 |
X
Y
Z |
ppm/℃ |
-55 to 288℃ |
IPC-TM-650
2.4.39A |
| Tg |
>280 |
>280 |
--- |
℃ |
A |
IPC-TM-650 2.4.24 |
Thermal
Conductivity |
0.64 |
0.62 |
--- |
W/m/°K |
100℃ |
ASTM F433 |
Moisture
Absorption |
0.04 |
0.04 |
--- |
% |
48 hrs immersion
0.060" sample
Temperature 50℃ |
ASTM D570 |
| Density |
1.79 |
1.86 |
--- |
N/mm
(pli) |
After solder float
1 oz. EDC Foil |
ASTM D792 |
| Copper Peel Strength |
1.05
(6.0) |
0.88
(5.0) |
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IPC-TM-650
2.4.8 |
| Flammability |
N/A |
94V-0 |
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UL |
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| STANDARD THICKNESS: |
STANDARD PANEL SIZE: |
STANDARD COPPER CLADDING: |
RO4003C™:
0.008"(0.203mm), 0.012"(0.305mm),
0.016 (0.406mm), 0.020"(0.508mm)
0.032"(0.813mm), 0.060"(1.524mm)
RO4350B™:
*0.004"(0.101mm), 0.0066"(0.168mm),
0.010"(0.254mm), 0.0133 (0.338mm),
0.0166"(0.422mm), 0.020"(0.508mm)
0.030"(0.762mm), 0.060"(1.524mm) |
12"x18"(305x457 mm)
24"x18"(610x457 mm)
24"x36"(610x915 mm)
48"x36"(1.224mx915 mm) |
 oz. (17 µm), 1 oz. (34 µm) and 2 oz. (70 µm) electrodeposited copper foil. |
* Approval needed for 0.004 mil material. Contact customer service.
(1) Dielectric constant and loss tangent are reported based on IPC-TM-2.5.5.5 @ GHz (stripline resonator). Departure from this method or frequency may yield different values. It has been reported that in some microstrip applications, a Delta (dielectric constant has been observed for both RO4003 and RO4350B based on actual circuit measurement and circuit modelingdielectric constant has been observed for both RO4003 and RO4350B based on actual circuit measurement and circuit modelingprocess while Rogers ensures the repeatability of the product received.
(2) Dielectric constant typical value does not apply to 0.004 (0.101mm) laminates. Dielectric constant specification value for RO4350B material is 3.36 ± 0.05. |
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