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RT/duroid®5870 /5880 High Frequency Laminates |
Features:
·Lowest electrical loss for reinforced PTFE material.
·Low moisture absorption.
·Isotropic
·Uniform electrical properties over frequency.
·Excellent chemical resistance.
Some Typical Applications:
·Commercial Airline Telephones
·Microstrip and Stripline Circuits
·Millimeter Wave Applications
·Military Radar Systems
·Missile Guidance Systems
·Point to Point Digital Radio Antennas |
| RT/duroid® 5870 and 5880 glass microfiber rein-forced PTFE composites are designed for exacting stripline and microstrip circuit applications. |
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| Glass reinforcing microfibers are randomly oriented to maximize benefits of fiber reinforcement in the directions most valuable to circuit producers and in the final circuit application. |
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| The dielectric constant of RT/duroid 5870 and 5880 laminates is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5870 and 5880 to Ku-band and above. |
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| RT/duroid 5870 and 5880 laminates are easily cut, sheared and machined to shape. They are resis-tant to all solvents and reagents, hot or cold,normally used in etching printed circuits or in plating edges and holes. |
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Normally supplied as a laminate with electrode-posited copper of  to 2 ounces/ft.2 (8 to 70 m)on both sides, RT/duroid® 5870 and 5880 compos-ites can also be clad with rolled copper foil for more critical electrical applications. Cladding with aluminum, copper or brass plate may also be specified. |
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| When ordering RT/duroid 5870 and 5880 laminates,it is important to specify dielectric thickness,tolerance, rolled or electrodeposited copper foil,and weight of copper foil required. |
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| PROPERTY |
TYPICAL VALUE |
DIRECTION |
UNITS |
CONDITION |
TEST METHOD |
| RT/duroid®5870 |
RT/duroid®5880 |
Dielectric
Constant,
|
2.33
2.33±0.02 spec. |
2.20
2.20±0.02 spec. |
Z
Z |
--- |
C24/23/50
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM-650 2.5.5.5 |
Dissipation
Factor, tan  |
0.0005
0.0012 |
0.0004
0.0009 |
Z
Z |
|
C24/23/50
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM-650 2.5.5.5 |
Thermal
Coefficient of , |
-115 |
-125 |
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ppm/℃ |
-50 - 150℃ |
IPC-TM-650 2.5.5.5 |
| Volume Resistivity |
2x107 |
2x107 |
Z |
Mohm·cm |
C96/35/90 |
ASTM D257 |
| Surface Resistivity |
3x108 |
3x108 |
Z |
Mohm |
C96/35/90 |
ASTM D257 |
Tensile Modulus
ultimate stress
ultimate strain |
Test at
23℃
1300(189)
1280(185) |
Test at
100℃
490 (71)
430 (63) |
Test at
23℃
1070 (156)
860 (125) |
Test at
100℃
450 (65)
380 (55) |
X
Y |
MPa (kpsi) |
A |
ASTM D638 |
50 (7.3)
42 (6.1) |
34 (4.8)
34 (4.8) |
29 (4.2)
27 (3.9) |
20 (2.9)
18 (2.6) |
X
Y |
MPa (kpsi) |
9.8
9.8 |
8.7
8.6 |
6.0
4.9 |
7.2
5.8 |
X
Y |
% |
Compressive Modulus
ultimate stress
ultimate strain |
1210 (176)
1360 (198)
803 (120) |
680 (99)
860 (125)
520 (76) |
710 (103)
710 (103)
940 (136) |
500 (73)
500 (73)
670 (97) |
X
Y
Z |
MPa (kpsi) |
A |
ASTM D695 |
30 (4.4)
37 (5.3)
54 (7.8) |
23 (3.4)
25 (3.7)
37 (5.3) |
27(3.9)
28 (5.3)
52 (7.5) |
22 (3.2)
21 (3.1)
43 (6.3) |
X
Y
Z |
MPa (kpsi) |
4.0
3.3
8.7 |
4.3
3.3
8.5 |
8.5
7.7
12.5 |
8.4
7.8
17.6 |
X
Y
Z |
% |
| Deformation Under Load |
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Test at 150℃
1.0 |
Z |
% |
24 hr/14 MPa
(2kpsi) |
ASTM D621 |
Heat Distortion
Temperature |
>260 (>500) |
>260 (>500) |
X,Y |
℃(°F) |
1.82 MPa
(264 psi) |
ASTM D648 |
| Specific Heat |
0.96 (0.23) |
0.96 (0.23) |
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Calculated |
Moisture Absorption
Thickness = 0.8 mm
(0.031)
Thickness = 1.6 mm
(0.062) |
0.9 (0.02)
13 (0.015) |
0.9 (0.02)
13 (0.015) |
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mg (%) |
D24/23 |
ASTM D570 |
| Thermal Conductivity |
0.22 |
0.20 |
Z |
W/m/K |
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ASTM C518 |
| Thermal Expansion |
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<<< |
mm/m |
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ASTM D3386
(10K/min)
(Values given are total change
from a base temperature of 35℃) |
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-100℃ |
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15 |
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25 |
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75 |
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150 |
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250 |
| Density |
2.2 |
2.2 |
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ASTM D792 |
| Copper Peel |
20.8 (3.7) |
22.8 (4.0) |
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pli (N/mm) |
after solder float |
IPC-TM-650 2.4.8 |
| Flammability |
94V-0 |
94V-0 |
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UL |
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[1] SI unit given first with other frequently used units in parentheses.
[2] References: Internal TR's 1430, 2224, 2854. Test were at 23℃ unless otherwise noted.
Typical values should not be used for specification limits. |
| STANDARD THICKNESS: |
STANDARD PANEL SIZE: |
STANDARD COPPER CLADDING: |
0.005" (0.127mm)
0.010" (0.254mm)
0.015" (0.381mm)
0.020" (0.508mm)
0.031" (0.787mm)
0.062" (1.575mm)
0.125" (3.175mm) |
18" X 12" (457 X 305mm)
18" X 24" (457 X 610mm)
18" X 36" (457 X 915mm)
18" X 48" (457 X 1.224m) |
oz. (8 µm) electrodeposited copper foil.
 oz. (17 µm), 1 oz. (35 µm), 2 oz. (70 µm) electrodeposited and rolled copper foil. |
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