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Metal Core Board Specification |
| ltem |
Test Condition |
CCAF-04 |
CCAF-01 |
| Estimated |
Test result |
Estimated |
Test result |
| Thermal resistance Max(℃/W) |
A |
≤2.0 |
0.7 |
≤2.0 |
0.8 |
| Thermal Conductivity |
Not available |
Not available |
Not available |
Not available |
Not available |
| Dielectric Breakdown (Kv)min |
A |
≥2.2 |
8.3 |
≥2.0 |
5.5 |
| Dielectric constant at 1 MHz Max |
(40°c,90%,96h)① |
≤4.4 |
2.4 |
≤4.4 |
4.2 |
| Peel Strength min(N/mm) |
A |
1.8 |
1.9 |
1.8 |
2.0 |
| After thermal stess |
1.8 |
1.8 |
| Flammability |
A |
Fv-o |
Fv-o |
Fv-o |
Fv-o |
| Blister test After thermal stress |
A |
288°C 2 min
No delamination |
OK |
260℃2min
No delamination |
OK |
| After thermal impact |
| Volume resistivity min(MΩ.m) |
A |
≥1×106 |
1××107 |
≥1×106 |
4×107 |
| (90%,35°C,96h)① |
≥1×106 |
1.9××107 |
≥1×106 |
5×107 |
| surface resistivity min(MΩ) |
A |
≥1×105 |
4.5×1006 |
≥1×105 |
5×106 |
| (90%,35°C,96h)① |
≥1×105 |
4.5×1006 |
≥1×105 |
2×1006 |
Dielectric dissipation factor(Kv)
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(40°c,90%,96h)①
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≥2.2 |
8.3 |
≥2.0 |
5.5 |
| Aluminum Base |
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97% |
97% |
97% |
97% |
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This test was done on MCB which the has Aluminum with 1mm thk & the dielectric layer with 0.07mm thk & the copper with 0.035mm thk(1oz).
* 1)2,3 or …. Oz copper it is available.
* 2) If the more thicker dielectric layer is needed it is available.
* 3) If the more thicker Aluminum base is needed it is available.
① : (Constant,humidity,treatment) |
Difference of thermal resistance by structure |
Structure:
■ Copper Foil
■ Insulation
■ Alminium Base
Description and Application:
Aluminum base conppet-clad laminate have excellent flame retardant , high mechanical strength, dimensional stability etc. Especially has veery good heat sink, electromagnetic shielding ang solder float. It’s widely used for the modifier and sparker on fire for motorcycle ang mobile, power LED, s0und box, power supply module and acoustics shielding system etc. |
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| Boaard size |
Structure |
Material |
330mm×380mm (13"×15")
500mm×600mm (20"×24")
500mm×500mm (20"×20")
333mm×500mm (13"×20") |
Copper Foil |
18um、35um、70um、105um、140um、210um |
Insulation
(Thermal Conductivity) |
80~200um |
Metal Base
(Aluminum/Copper/
Iron) |
0.5mm、0.8mm、1.0mm、1.2mm、1.5mm、
2.0mm、2.5mm、3.0mm、4.0mm |
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