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Thermal Conductivity & Thermal Resistance |
| Structure |
Insulation layer |
Base |
Thermal Resistance(℃/W) |
| Type |
Thermal Conductivity(W/m•K) |
Thickness
(μm) |
Type |
Thermal Conductivity(W/m•K) |
Thickness
(mm) |
| FR-4+Al |
Epoxy |
0.36 |
160 |
Al |
228 |
1.0 |
3.17 |
| Metal Base |
High Performance Epoxy |
2.0 |
80 |
Al |
228 |
1.0 |
0.29 |
| 3.0 |
80 |
Al |
228 |
1.0 |
0.19 |
| 6.5 |
80 |
Al |
228 |
1.0 |
0.088 |
| 12.0 |
80 |
Al |
228 |
1.0 |
0.048 |
| 12.0 |
60 |
Al |
228 |
1.0 |
0.036 |
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Difference in effect of heat radiation by thermal resistance of PCB |
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| 〓 Returns to the product catalog 〓 |
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